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SMT工艺的构成及点胶在SMT工艺上的应用介绍

发布时间:2019-07-29 15:54:44   来源:本文搜集于网络,由自动点胶机厂家创盈时代整理并发布,欢迎转载    点击:

SMT是由混合集成电路技术发展而来的新一代电子装联技术,以采用元器件表面贴装技术和回流焊接技术为特点,成为电子产品制造中新一代的组装技术。SMT 的广泛应用,促进了电子产品的小型化、多功能化,为大批量生产、低缺陷率生产提供了条件。
SMT is a new generation of electronic assembly technology developed by hybrid integrated circuit technology, characterized by the use of component surface mounting technology and reflow welding technology, and become a new generation of assembly technology in electronic product seistic manufacturing。 The wide application of SMT promotes the miniaturization and versatility of electronic products, which provides conditions for mass production and low defect rate production。

SMT就是使用一定的工具将无引脚的表面贴装元器件准确地放置到经过印刷焊膏或经过点胶的PCB焊盘上,然后经过波峰焊或回流焊,使元器件与电路板建立良好的机械和电气连接,SMT工艺构成包括一下几个方面。
SMT is the use of a certain tool to pinless surface mount components accurately placed on the printed solder paste or through the dispensing PCB pad, and then through the wave welding or back-flow welding, so that the components and the board to establish a good mechanical and electrical connection, SMT process composition includes several aspects。

丝印和点胶,丝印的作用是将焊膏或贴片胶漏印到PCB的焊盘上,为元器件的焊接做准备。所用设备为丝印机也叫丝网印刷机,位于SMT生产线的最前端。点胶,它是将胶水滴到PCB的固定位置上,其主要作用是将元器件固定到 PCB板上。所用设备为点胶机,位于SMT生产线的最前端或检测设备的后面。
Silk screen and dispensing, the role of silk screen is to solder paste or patch glue leakage to the PCB pad, in preparation for the welding of components. The equipment used is a screen press, also known as a screen press, located at the front of the SMT production line. Dispensing, it is the glue drop to the fixed position of the PCB, its main function is to fix the components to the PCB board. The equipment used is a dispensing machine, located at the front end of the SMT production line or behind the inspection equipment.

SMT点胶生产线

贴装和固话,贴装的作用是将表面组装元器件准确安装到PCB的固定位置上,所用设备为贴片机,位于SMT生产线中丝印机的后面,固化,其作用是将贴片胶融化,从而使表面组装元器件与PCB板牢固粘接在一起。所用设备为固化炉,位于SMT中贴片机的后面。
Placement and fixed-line, the role of the placement is to the surface assembly components accurately installed in the fixed position of the PCB, the equipment used for the patch machine, located in the SMT production line behind the wire printing machine, curing, its role is to melt the patch glue, so that the surface assembly components and PCB board firmly bonded together. The equipment used is a curing furnace, located behind the patcher in the SMT.

回流焊接和清洗,回流焊的作用是将焊膏融化,使表面组装元器件与PCB板牢固粘接在一起。所用设备为回流焊炉,位于SMT中贴片机的后面。清洗,其作用是将组装好的PCB板上面的对人体有害的焊接残留物如助焊剂等除去。所用设备为清洗机,位置可以不固定,可以在线,也可不在线。
Reflow welding and cleaning, the role of reflow welding is to melt the solder paste, so that the surface assembly components and PCB board firmly bonded together. The equipment used is a reflux welding furnace located behind the patcher in the SMT. Cleaning, the role of which is to remove the harmful welding residues such as flux esclose on the assembled PCB board. The equipment used is a cleaner, the location can not be fixed, can be online, or not online.

最后就是检测,其作用是对组装好的PCB板进行焊接质量和装配质量的检测。所用设备有放大镜、显微镜、在线测试仪、飞针测试仪、AOI自动光学检测设备、X-RAY检测系统、功能测试仪等。位置根据检测的需要,可以配置在生产线合适的地方。 
Finally, the test, its role is to assemble the PCB board welding quality and assembly quality testing。 The equipment used is a magnifying glass, microscope, online tester, fly pin tester, AOI automatic optical detection equipment, X-RAY detection system, functional tester and so on。 Location sits in the right place on the production line according to the needs of the test。

深圳市创盈时代科技有限公司是一家专注于平台点胶机,落地式点胶机,视觉点胶机,手机点胶机,非标自动化设备的研发生产和销售于一体的国家高新技术点胶机厂家。

本文关键字:SMT工艺流程

原文地址:http://www。chytime。com/hyxw1/1804。html

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