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SMT贴片点胶操作工艺中的注意事项

发布时间:2019-05-06 16:08:19   来源:本文搜集于网络,由自动点胶机厂家创盈时代整理并发布,欢迎转载    点击:

SMT贴片点胶工艺中常见的工艺缺陷:胶点大小不合格、拉丝、胶水浸染焊盘、固化强度不好易掉片等,解决这些问题应整体研究各项技术工艺参数,从而找到解决问题的办法,那么SMT贴片点胶操作工艺中的注意事项有哪些呢?
SMT patch dispensing process common process defects: the size of the glue is not qualified, wire drawing, glue dip-dyeing pad, curing strength is not easy to drop, etc。, to solve these problems should be the overall study of the technical parameters, in order to find a solution to the problem, then SMT patch dispensing operation process what are the matters needing attention?

第一,胶水温度和胶水的粘度
First, the temperature of the glue and the viscosity of the glue

一般环氧树脂胶水应保存在0--5℃的冰箱中,使用时应提前4小时拿出,使胶水充分与工作温度相符合。胶水的使用温度应为23℃--25℃;环境温度对胶水的粘度影响很大,温度过低则会胶点变小,出现拉丝现象。环境温度相差5℃,会造成50%点胶量变化。因而对于环境温度应加以控制。同时环境的温度也应该给予保证,湿度小胶点易变干,影响粘结力。
General epoxy resin glue should be stored at 0-5 ℃ refrigerator, use should be 4 hours in advance when pulled out, make glue fully consistent with the operating temperature. The use of glue temperature should be 23 ℃, 25 ℃; Ambient temperature on the viscosity of glue has a great impact, the temperature is too low will glue point smaller, wire drawing phenomenon. The environment temperature is 5 ℃, can cause 50% dispensing quantity change. Therefore, the ambient temperature should be controlled. At the same time the environment temperature should also be given to ensure that the humidity small glue point easy to dry, affect the adhesive force.
自动点胶机

胶的粘度直接影响点胶的质量。粘度大,则胶点会变小,甚至拉丝;粘度小,胶点会变大,进而可能渗染焊盘。点胶过程中,应对不同粘度的胶水,选取合理的背压和点胶速度。对于胶水的固化,一般生产厂家已给出温度曲线。在实际应尽可能采用较高温度来固化,使胶水固化后有足够强度。
The viscosity of glue directly affects the quality of glue. Viscosity is large, the glue point will become smaller, or even wire drawing; Small viscosity, glue point will become larger, and may be infiltrated dye pad. In the process of dispensing, the reasonable back pressure and dispensing speed should be selected for different viscosities of glue. For glue curing, general manufacturers have given the temperature curve. In practice, higher temperature should be adopted as far as possible to solidify, so that the glue is strong enough after curing.

第二,自动点胶机针头与PCB板间的距离
Second, the distance between the needle of the automatic dispenser and the PCB board

不同的点胶机采用不同的针头,有些针头有一定的止动度。每次工作开始应做针头与PCB距离的校准,即Z轴高度校准。还有胶水一定不能有气泡,一个小小气就会造成许多焊盘没有胶水;每次中途更换胶管时应排空连接处的空气,防止出现空打现象。
Different dispensing machines use different needles, some needles have a certain degree of immobility. At the beginning of each work, the distance between the needle and PCB should be calibrated, that is, z-axis height calibration. And the glue must not have bubbles, a small gas will cause many welding disc without glue; Replace the hose in the middle of each connection should be empty of air, to prevent the phenomenon of empty hit.

深圳市创盈时代科技有限公司是一家专注于平台点胶机,落地式点胶机,视觉全自动点胶机,非标自动化设备的研发生产和销售于一体的国家高新技术点胶机厂家。

本文关键字:点胶工艺 胶水

原文地址:http://www.bananacanon.com/news/djjs/1793.html

本文由www.bananacanon.com 深圳创盈时代科技有限公司 自动点胶机整理,欢迎转载,转载时请标明出处。

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