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发布时间:2019-05-13 16:51:05   来源:本文搜集于网络,由自动点胶机厂家创盈时代整理并发布,欢迎转载    点击:

SMT的工艺流程一般按照印刷点胶,贴装,固化,回流焊接,清洗,检测等几大步骤,接下来,自动点胶机厂家来为你一一解读各个流程的作用。
SMT process is generally in accordance with the printing point glue, mount, curing, reflow welding, cleaning, testing and other steps, and then, automatic dispensing machine manufacturers to explain to you one by one the role of each process.

因现在所用的电路板大多是双面贴片,为防止二次回炉时投入面的元件因锡膏再次熔化而脱落,故在投入面加装点胶机,它是将胶水滴到PCB的固定位置上,其主要作用是将元器件固定到PCB板上。所用设备为自动点胶机,位于SMT生产线的最前端或检测设备的后面。有时由于客户要求产出面也需要点胶,而现在很多小工厂都不用点胶机,若投入面元件较大时用人工点胶。
Because most of the circuit boards used now are double-sided patches, in order to prevent two furnace when the input surface of the components due to the solder paste again melting and shedding, so in the input surface plus decorative glue machine, it is the glue dripping to the fixed position of the PCB, its main role is to secure the components to the PCB board. The equipment used is an automatic dispensing machine, located at the front end of the SMT production line or behind the detection equipment. Sometimes because the customer requirements output surface also need dispensing, and now many small factories do not use dispensing machine, if the input surface components are larger with manual dispensing.

点胶机流水线

贴装的作用是将表面组装元器件准确安装到PCB的固定位置上,所用设备为贴片机,位于SMT生产线中印刷机的后面。固化是将贴片胶融化,从而使表面组装元器件与PCB板牢固粘接在一起。所用设备为固化炉,位于SMT生产线中贴片机的后面。回流焊接是将焊膏融化,使表面组装元器件与PCB板牢固粘接在一起,所用设备为回流焊炉,位于SMT生产线中贴片机的后面。
The function of the mount is to accurately install the surface assembly components into the fixed position of the PCB, the equipment used as a SMT, located in the SMT production line behind the printing press. Curing is the melting of the patch glue, so that the surface assembly components and PCB board firmly glued together. The equipment used is a curing furnace, located in the SMT production line in the back of the SMD machine. Reflow welding is to melt the solder paste, so that the surface assembly components and PCB board firmly glued together, the equipment used for the reflow welding furnace, located in the SMT production line in the back of the SMD machine.

清洗是将组装好的PCB板上面的对人体有害的焊接残留物如助焊剂等除去,所用设备为清洗机,位置可以不固定,可以在线,也可不在线。检测是对组装好的PCB板进行焊接质量和装配质量的检测。所用设备有放大镜、显微镜、在线测试仪、飞针测试仪、CCD视觉检测设备、X-RAY检测系统、功能测试仪等。位置根据检测的需要,可以配置在生产线合适的地方。
Cleaning is the assembly of the PCB board on the harmful welding residue of the human body, such as flux, the use of equipment for the cleaning machine, the location can not be fixed, can be online, or can not be on the line. Testing is the inspection of welded quality and assembly quality of assembled PCB boards. The equipment used is magnifying glass, microscope, on-line tester, flying needle tester, CCD vision testing equipment, X-RAY detection system, functional tester and so on. Location according to the needs of testing, can be configured in the production line suitable place.

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本文关键字:SMT工艺点胶

原文地址:http://www.bananacanon.com/news/djjs/1794.html

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